Advanced Process Technologies
- GaN power and RF process technology (proprietary)
- Silicon CMOS from 180nm down to 5nm nodes (through strategic partnerships)
- GaN-on-Si and GaN-on-SiC platforms
- Silicon Carbide (SiC) process integration
- Advanced packaging solutions (2.5D and 3D integration)
Design Capabilities
- Full-custom analog/mixed-signal IC design
- Digital ASIC design and verification
- RF/microwave circuit design
- Power electronics design
- System-on-Chip (SoC) integration
- Hardware security implementation
- IP core development and licensing
Manufacturing Excellence
- Class 100/1000 cleanroom facilities
- 6" and 8" wafer processing capability
- Advanced lithography systems
- Comprehensive metrology and inspection
- Reliability testing and qualification
- Failure analysis and yield optimization
- Environmental testing facilities
